Assembly of Silicon Micro-parts with Steel Spindles Using Low-Temperature Soldering - Precision Assembly Technologies and Systems Access content directly
Conference Papers Year : 2014

Assembly of Silicon Micro-parts with Steel Spindles Using Low-Temperature Soldering

Abstract

A new assembly method for silicon micro-parts with non-planar steel parts is proposed: low-temperature soldering. Existing techniques for micro-mechanical assemblies are analyzed and compared to the proposed method, the method is explained and validated on an existing product using functional tests. Performances of the reference method (adhesive bonding) are not yet fully reached, but the results are close and partially fulfil the specifications of the current production.
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hal-01260717 , version 1 (22-01-2016)

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Laurenz Notter, Jacques Jacot. Assembly of Silicon Micro-parts with Steel Spindles Using Low-Temperature Soldering. 7th International Precision Assembly Seminar (IPAS), Feb 2014, Chamonix, France. pp.8-14, ⟨10.1007/978-3-662-45586-9_2⟩. ⟨hal-01260717⟩
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