Parallel Packaging of Micro Electro Mechanical Systems (MEMS) Using Self-alignment - Precision Assembly Technologies and Systems (IPAS 2012) Access content directly
Conference Papers Year : 2012

Parallel Packaging of Micro Electro Mechanical Systems (MEMS) Using Self-alignment

Abstract

Packaging is one of the major cost drivers for MEMS devices. Currently wire bonding is the dominant method for electrically connecting MEMS chips to substrate. Using self-alignment a method for packaging multiple MEMS at the same time has been developed. The presented process achieves high throughput and precise alignment at low cost. The Controlled Collapse Re-flow Chip Joining (C-4) process has been adapted to the specific requirements of MEMS. The combination of coarse robotics and liquid solder self-alignment guarantees precise positioning and alignment of the individual MEMS chips to the respective substrates. The new method has been implemented in a case study. In the study force sensors have been packaged. Precise angular alignment of the sensors is critical for receiving accurate measurements. Results of the case study are presented.
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hal-01363876 , version 1 (12-09-2016)

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Jens Taprogge, Felix Beyeler, Alexander Steinecker, Bradley J. Nelson. Parallel Packaging of Micro Electro Mechanical Systems (MEMS) Using Self-alignment. 6th International Precision Assembly Seminar (IPAS), Feb 2012, Chamonix, France. pp.28-35, ⟨10.1007/978-3-642-28163-1_4⟩. ⟨hal-01363876⟩
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